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梭特攻Hybrid Bonder 搶進先進封裝
從最早使用導線架封裝，到後來發展至BGA、Flip Chip、2.5D及3.D封裝，及至最新的Hybrid Bondin...
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SEMICON／京皓科技 拓展半導體多元技術版圖
因應全球半導體需求持續提升，京皓科技在2023年SEMICON TAIWAN擴大展出，除展出所代理日本「初田製作所」（H...
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偉智光電 掌握矽光子晶片元件技術
人工智慧(AI)技術是未來全球科技發展主要方向之一，AI最重要的是資料中心，伺服器需要處理巨量數據，運算速度需不斷提升，以銅導線傳遞信號的傳統晶片終將達到物理極限，以光波導為技術的矽光子晶片能符合AI
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直擊SEMICON Taiwan！ 施耐德電機數位化及電氣化策略助半導體產業邁向永續
能源管理及自動化領域的數位轉型領導者法商施耐德電機Schneider Electric今日出席SEMICON Taiwan 2023，在半導體永續力國際論壇中分享台灣如何與半導體產業一起打造永續未來。
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擎傑Memosens 2.0 提升半導體製程效率
Endress+Hauser台灣總代理「擎傑企業」為協助業者克服惱人的電極維護，有感提升製程效率，配合SEMICON Taiwan...
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